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Filtering by: Creator Dawei Li Resource type Dissertation Subject Computer Engineering

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Description:: 3D integration of integrated circuits is becoming a prominent solution in the design of high performance chips. Multiple dies can be stacked in a single 3D structure and utilizes Through Silicon Vias (TSV) for die to die communications. While this feature significantly decrease the latency of data transfer, multi-tier stacking...
Keyword:: SRAM, Power Modeling, DRAM, TSV, CAM, and 3D IC
Subject:: Computer Engineering
Creator:: Dawei Li
Owner:: Scholarly Digital Publishing
Date Uploaded:: 04/16/2018
Date Modified:: 04/16/2018
Date Created:: 2017-01-01
Resource Type:: Dissertation

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