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Filtering by: Creator Ja Chun Ku Keyword Engineering

1 entry found

Description:: As technology moves into deep submicron and nanoscale era, undesirable trends such as increasing power density, leakage power, and temperature variation within chips have made thermal effects emerge as a major bottleneck in further technology scaling. Thermal effects are no longer considered as just a reliability issue, but it also...
Keyword:: Electronics and Electrical and Engineering
Subject:: Electrical and Computer Engineering
Creator:: Ja Chun Ku
Owner:: Scholarly Digital Publishing
Date Uploaded:: 06/01/2018
Date Modified:: 06/01/2018
Date Created:: 2007-05-14
Resource Type:: Dissertation

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