Northwestern University

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Filtering by: Keyword 3D Integrated Circuits Keyword TSV Model

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High Performance Caches and Interconnects for Many-Core and 3D Integrated Circuits

Description:

Integrated circuits have been continuously scaled to increase speed and integration density as a means to improve the performance or pack more functionality. However, an extremely enormous amount of effort is needed to further scale the dimensions in deep submicron technologies. As technology scaling is slowing down and design complexity...

Keyword:

Caches, Global Interconnect Link, Many-Core Microprocessors, 3D Integrated Circuits, Dynamic Stability, and TSV Model

Subject:

Electrical and Computer Engineering

Creator:

DiaaEldin Khalil

Owner:

Scholarly Digital Publishing

Date Uploaded:

09/06/2018

Date Modified:

09/06/2018

Date Created:

Many-Core Microprocessors

Resource Type:

Dissertation