3D integration of integrated circuits is becoming a prominent solution in the design of high performance chips. Multiple dies can be stacked in a single 3D structure and utilizes Through Silicon Vias (TSV) for die to die communications. While this feature significantly decrease the latency of data transfer, multi-tier stacking...
Thermal overheating is a serious concern in modern supercomputing systems. Elevated temperature levels reduce the reliability and the lifetime of the underlying hardware and increase their power consumption. Previous studies on mitigating thermal hotspots at the hardware and run-time system levels have typically used approaches that trade off performance for...
Data mining for materials discovery is concerned with representing materials science problems into a statistical framework, and learning models that describe observations about the processing, structure, and property of materials. The type of materials includes metals, ceramics, glass, polymers, and composites which are mixtures of multiple types. Observations come from...