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Thermal Characterization and Management of 3D Integrated Circuits

Description:

3D integration of integrated circuits is becoming a prominent solution in the design of high performance chips. Multiple dies can be stacked in a single 3D structure and utilizes Through Silicon Vias (TSV) for die to die communications. While this feature significantly decrease the latency of data transfer, multi-tier stacking...

Keyword:

SRAM, Power Modeling, DRAM, TSV, CAM, and 3D IC

Subject:

Computer Engineering

Creator:

Dawei Li

Owner:

Scholarly Digital Publishing

Date Uploaded:

04/16/2018

Date Modified:

04/16/2018

Date Created:

2017-01-01

Resource Type:

Dissertation