Northwestern University

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Filtering by: Creator Ja Chun Ku Subject Electrical and Computer Engineering

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Thermal Effects on VLSI Circuits and Microarchitecture

Description:

As technology moves into deep submicron and nanoscale era, undesirable trends such as increasing power density, leakage power, and temperature variation within chips have made thermal effects emerge as a major bottleneck in further technology scaling. Thermal effects are no longer considered as just a reliability issue, but it also...

Keyword:

Electronics and Electrical and Engineering

Subject:

Electrical and Computer Engineering

Creator:

Ja Chun Ku

Owner:

Scholarly Digital Publishing

Date Uploaded:

06/01/2018

Date Modified:

06/01/2018

Date Created:

2007-05-14

Resource Type:

Dissertation