Index Catalog // Arch : Northwestern University Institutional Repository

Start Over

Filtering by: Creator DiaaEldin Khalil Keyword Global Interconnect Link Keyword TSV Model

1 entry found

Description:: Integrated circuits have been continuously scaled to increase speed and integration density as a means to improve the performance or pack more functionality. However, an extremely enormous amount of effort is needed to further scale the dimensions in deep submicron technologies. As technology scaling is slowing down and design complexity...
Keyword:: Caches, Global Interconnect Link, Many-Core Microprocessors, 3D Integrated Circuits, Dynamic Stability, and TSV Model
Subject:: Electrical and Computer Engineering
Creator:: DiaaEldin Khalil
Owner:: Scholarly Digital Publishing
Date Uploaded:: 09/06/2018
Date Modified:: 09/06/2018
Date Created:: Many-Core Microprocessors
Resource Type:: Dissertation

LIBRARIES | ARCH