Northwestern University

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Filtering by: Creator Yao Yao Subject Civil and Environmental Engineering

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Modeling the Mechanical Properties of Intermetallic/Solder Interfaces

Description:

Solder joint integrity is recognized as a key issue in the reliability of flip chip and ball grid arrays in integrated circuit packages. Significant reductions in the solder-joint interconnect size results in both the increased volume fraction of brittle intermetallics in the joint and joule heating and electromigration failure due...

Keyword:

Mechanical Engineering

Subject:

Civil and Environmental Engineering

Creator:

Yao Yao

Owner:

Scholarly Digital Publishing

Date Uploaded:

09/19/2018

Date Modified:

09/19/2018

Date Created:

2008-11-03

Resource Type:

Dissertation